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Phasak DTA 025 heat sink compound Thermal paste 0.925 W/m·K 25 g (DTA 025)

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Pasta Térmica PHASAK Blanca 25 gr - DTA 025
Auf Lager
SKU
16679100
Wärmeleitpasten

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The
PHASAK White Thermal Paste
in syringes of
5g, 8g, and 25g
(References: DTA 035, DTA 038, and DTA 025) is an advanced solution for enhancing heat transfer between the chip and the metal heat sink, providing efficient cooling for high-performance electronic components such as
processors, chipsets, and graphics cards
.


Key Features:


Thermal Conductivity:
> 0.925 W/m-K, ensuring effective heat transfer to the heat sink.

Thermal Impedance:
< 0.229 ºC/W, minimizing thermal resistance for efficient cooling.

Dielectric Constant:
> 5.1, ensuring safe electrical insulation.

Operating Temperature Range:
-30 ºC to 300 ºC, suitable for extreme temperature conditions.

Syringe Presentation:
Available in sizes of 5g, 8g, and 25g, providing versatile options for various maintenance and assembly applications.

This white thermal paste is ideal for systems requiring reliable and long-lasting heat dissipation, ensuring component protection in high-demand environments.
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